Lightmatter, a startup valued at $4.4 billion, has introduced two new technologies aimed at enhancing the speed and efficiency of AI chip connections. Instead of relying on traditional electrical signals, Lightmatter’s innovations use optical connections and silicon photonics, which leverage light to transmit data between chips.
Breakthrough in AI Chip Interconnects
The Mountain View, California-based company has raised $850 million in venture funding as interest in optical technologies grows. These innovations are being explored as a way to enhance AI performance, especially for applications like chatbots, image generation, and large-scale AI models.
Lightmatter’s latest releases include:
- An Interposer – A layer of material that sits beneath an AI chip, allowing it to seamlessly connect with neighboring chips. (Expected release: 2025)
- A Chiplet – A compact tile that can be placed on top of an AI chip to improve performance. (Expected release: 2026)
The interposer is being manufactured by GlobalFoundries (GFS.O).
Growing Interest in Optical AI Technologies
Other AI chip companies, including AMD (AMD.O) and Nvidia (NVDA.O), are also investing in optical interconnects. Earlier this month, Nvidia introduced optical technology in some of its networking chips, though CEO Jensen Huang noted that the technology is not yet mature enough for widespread use.
If successful, Lightmatter’s optical interconnects could revolutionize AI computing, enabling faster and more efficient chip-to-chip communication—a critical factor for the next generation of AI applications.
